|
Max kV
|
130 kV
|
|
Max. electron beam power
|
10 W
|
|
X-ray source
|
Open transmission target tube
|
|
X-ray spot size
|
3 µm
|
|
Defect recognition capability
|
2 µm
|
|
Geometric magnification
|
2.5x-2,400x
|
|
System magnification
|
Up to 36,000x
|
|
Imaging system (Standard)
|
1.45 Mpixel 12-bit camera with 6" image intensifier
|
|
Imaging system (Option)
|
Varian 1313 or 2520 Digital flat panel
1Mpixel 12bit camera with dual field 4"/6" image intensifier
|
|
Manipulator
|
4-axis (X, Y, Z, T)
|
|
Rotate axis
|
Optional
|
|
Tilt
|
0 - 75 degrees
|
|
Measuring volume:
|
Largest square in single map 406x406 mm (16x16")
Absolute max 711x762 mm (28x30")
|
|
Max. sample weight:
|
5 kg (11 lbs)
|
|
Dimensions (BxWxH)
|
1,225 x 1,810 x 2,145 mm (48x71x84")
(incl. monitor bracket and lamp tower)
|
|
Weight
|
1,935 kg (4,266 lbs)
|
|
Radiation safety
|
<1 μSv/hr at the cabinet surface
|
|
Control:
|
Inspect-X control and analysis software
|
|
Automation inspection
|
Optional
|
|
Computed Tomography
|
Optional
|
|
Applications
|
Real-time inspection of electronics
(BGA, µBGA, flip-chip and loaded PCB boards)
|