- Non contact, non destructive measurement
- Parameter setting after spectrum analysis
- High speed real-time monitoring during CMP, BG
- Measurement over interlayer such as protection film and window material
- Multi layers analysis
- Original analytical engine (Patent pending)
- Original analytical algorism for thickness measurement (Patented)
- Automatic mapping function for thickness distribution
Thông số kỹ thuật
- Measurement range : 0.1μm ～ 10μm、15μm ～ 1000μm、10μm ～ 775μm*、50μm ～ 1600μm*
- Reproduciblity : < 0.01%
- Measurement time : 200μs(5kHz) ～
- Light source : semiconductor laser
- Spot size : Min φ6μm
- WD : 10mm or longer
- Size : 123（W）×224（D)×128（H）mm