It is possible to unite with the characteristic of each work, and for a maximum of 9 steps to subdivide, and to program the up-and-down speed and dip time to a solder dip tub by application of microcomputer technology. This dip data can input up-and-down speed, stop time, and the amount of up-and-down movements for every step, respectively, and can set up the optimal soldering conditions for a work.
To 50 kinds, the inputted dip data is memorized by backup RAM and can be called at any time if needed. Dealing also with a plan substitute quickly is possible.
Adoption of the new method realized not less than 30% of improvement in the speed compared with old equipment. (Our comparison) Moreover, removal of a solder icicle is also performed simultaneously.
Adoption of the new method realized not less than 30% of improvement in the speed compared with old equipment. (Our comparison) Moreover, removal of a solder icicle is also performed simultaneously.
The input of dip data can be easily performed by key operation, looking at LCD (liquid-crystal-display screen) on a panel.
| Lead frame attachment machine |
FI-930T type use |
| Lead frame standard size cut length |
MAX 280mm |
| An application lead frame size and a substrate size |
W：65mm or less
D：40mm or less
L1：8～20mm
L2：55mm or less
T：0.6～8mm
(It is clamper exchange when T is 9?13 mm.) A clamper is an option. |
| The direction of a work flow |
The left -> right |
| Work conveyance |
Belt conveyance -> mechanism zipper system |
| Flux application |
Dip system (sub tub up-and-down system) |
| Preheating system |
Far-infrared heater（0～200℃） |
| Soldering system |
Dip system (the solder sub tub up-and-down system by a pulse motor, a 0.1-mm step arbitrary setting good, and a display are liquid crystal display) |
| Baton time |
About 12 seconds (it contains for about 3 seconds solder immersion time) |
| Dip system |
An arbitrary setup in key operation is possible till 0 to 9.9 seconds. |
| Solder surface dregs removal |
Each time, it is based on a scraper. |
| Solder icicle removal |
It is based on a ceramic heater. |
| Work recovery |
it is based on an exclusive career -- dropping |
| Memory function |
50 kinds (they are an arbitrary setup and liquid crystal display by key operation, such as the amount of soldering up-and-down movements, immersion time, and up-and-down speed) |
| Power supply |
200V (single phase), 50/60 Hz, 30A |
| Common sky pressure |
Dry air 5kg/cm2 Air pressure display (panel side) |
| Outside dimension |
L abbreviation 1,910 x W 985 x H 1,390mm |
| Weight |
About 250 kg |
| Solder tub capacity |
About 20 kg |
| Painting color |
ECG standard color (2.5V7.6/1.4 leather color) |
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