Entry-level model for bonding gold wires between 17.5 and 50 µm diameter.
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitchbond mode.
Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. You always work with repeatable results – also after a lot of years. The handling, supported by a colour display and the input with a shuttle-wheel make the programming of the machine very easy. The operator can create different kinds of loops with the manipulator system. Operators require only a minimum of training, making the 5310 manual ball bonder the ideal choice for prototype, rework and small-scale production.
The 5310 is perfectly suited for complex bond-tasks, optimal quality and the most favourable price. This machine is the right choice for such applications.