The automatic bond tester 5700C XL complements F&S Bondtec Semiconductor GmbH die- and wire-bonders.
The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.
Powerful extended capabilities enable measurements such as force/time or force/distance curves to be made and deliver more data about the quality of the bond tested. Exchangeable measurement cartridges ensure rapid conversion to different force ranges. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customerspecific tools and jaws are available.
After a first programming a reproducible pull- or sheartest can be guaranteed for all following components.