Electronics Manufacturing X-Ray AX8200 Unicom

Product Description:
AX8200 is the end of 2010 should be the needs of our customers to launch 
large-capacity high-resolution high magnification of the new X-RAY detection system. 
Excellent test results for large circuit boards above the BGA, CSP, flip chip detection, 
semiconductor, packaging components, electronic connector module detection, printed circuit 
board solder joint testing, ceramic products, aviation components, solar panels Battery industry 
and other special industry testing. For large circuit boards and large panels (can put the same module) 
can be programmed with automatic detection accuracy and repeatability is high. 


Product Application:
● pcba solder joint detection (BGA, CSP, POP and other components detection) 
● battery (pole piece solder joint defect detection, core winding detection) 
● electronic connectors (wiring harness, cable, plug, etc.) 
● Automotive electronics (patch cord, dashboard, etc.) 
● solar, photovoltaic (silicon solder joint detection) 
● aviation components and other special industry testing 
● semiconductor (packaging components detection) 
● LED detection 
● electronic module detection 
● ceramic products detection


standard:
● 4/2 (optional 6-inch) image intensifier and a digital camera megapixels; 
● 90KV / 100KV X-ray source. 5 microns; 
● simple mouse click operation detection program written; 
● detection High accuracy ; 
● High-performance stage control; 
● Large navigation window - easy to locate and identify defective products; 
● Automatic BGA detection program to accurately detect each BGA's Bubble, 
according to customer needs to determine and output Excel report. 

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