●Can test and evaluate solder paste, PC board and parts-lead.
●All wetting process can be observed from glass windows.
●"Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method"
are possible optionally.
●Can simulate reflow oven profile with hot air and N2 purge.
●Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be
examined by this unit.