- ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness measurements of backside thinned and polished samples; it is also invaluable for fast imaging and archiving of die samples being parallel polished / de-processed.
- The system accepts ULTRA TEC's ASAP-1® sample mounting plates and ULTRAPOL Advance quick release sample holders.
- Three Imaging Modes are available -- NIR as standard, with options for UV and high res visible. The ICis' Custom software includes imaging, image optimization, annotation, Silicon Thickness measurement, navigation and archival functions.
- Key applications of ICis are in Imaging topside x-section & backside electronic polished samples. ICis is an invaluable tool for validation of polished surface quality and for assessing de-processing position.
- Three Modes Available -- NIR as Standard, with options for UV and high res visible
- Custom software includes imaging, image optimization,annotation, Silicon Thickness measurement, navigation and archival functions.
- Images topside x-section & backside electronic polished samples
- For validation of polished surface quality and for assessing de-processing position