- ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.
- Key applications of the technology include:
Topside electronic de-processing - enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR.
- Along with ULTRA TEC’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.
- Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.
- The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a ‘Power polish’ mode is incorporated that rotates the sample during processing.
- Better delayering results - The ULTRACOLLIMATOR option allows for improved parallelism, improving the ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment - precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander.
- slurry polishing - A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use.
- Avoids cross-contamination - The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
-Industry-leading supplier - ULTRA TEC has supplied sawing, lapping & polishing equipment to the high-tech industries for over 30 years. Our ASAP-1, ARC-lite, MULTIPOL & ULTRAPOL products have set the standard for sample preparation