- Fully automated 3D solder paste inspection, bench-top, low cost system for SMT process. Fully programmable and automatic. The whole board inspection takes only minutes and results are presented with SPC. One bench top unit is capable of supporting multiple SMT lines.
+ Fully Automated 3D solder paste inspection
+ 3D scan measure height, area and volume
+ 3D simulation & recombination view
+ Programmable multi-area 3D scan measurement
+ Auto focus check to offset PCB warping
+ Programmable, automatic & repeatable
+ Large board size with adjustable board holder
+ Full SPC functions
+ Product and production line details entry