Low cost, off-line 3D SPI system supports multiple SMT lines for inspecting solder paste printing.
SPI-200-3D will improve your product yield and meet your customer requirement with affordable budget.
Same measuring technique as high end automated in-line SPI system.
3D SPI off-line, entry level
Powerful 3D real-time view of solder paste
Zoom 30x – 200x
Inspection and measurement of solder joints, components, traces, pads, holes, and BGA
Versatile, 3-in-1 system, economical
Simple mouse clicks to get results FAST
Economic, off-line, bench-top unit that supports multiple SMT lines
Save measurements with image, and export measurement results to Excel
One USB2.0 connection to your Windows computer, install software, and ready to use