Caltex innovative 3D rotational view plus 90° BGA inspection mirror provide unprecedented optical BGA inspection capability at 90° view for QC and failure analysis at very affordable price for circuit board manufacturers using BGA and QFP. The system is very easy to use and extremely robust for production environment. Real time view of BGA inspection, capturing defect image for documentation, and performing dimensional measurement on BGA ball size and pitch, all with better image clarity and less expensive than X-ray system.
1080p HD 6MP camera for real-time HD image inspection
3D rotational mirror to see BGA side view in real time 3D
Capture image without a computer
Measure software included for computer USB2.0 connection
1080p HD camera in real-time 3D rotational inspection of BGA solder joints
90° viewing angle of BGA mirror plus rotating view of top and bottom of BGA balls
clever and innovative concept, very easy to use, robust in production environment
easy view of outside row and some inside row
zoom 15x-100x
connecting to computer for live image viewing, snap picture, record video on your computer
measurement software to measure BGA ball size and pitch (included)
perfect for inspecting solder joints of fine pitch, J-leads, connector, and side walls of through holes
choose from latest 1080p HD camera, USB 2.0, USB 3.0, or PadCam camera technology
very affordable under $5,000 price range
cracked BGA solder joints
see solder surface and texture
zoom out for wider viewing area