This integrated system offers film thickness measurements required by the exacting standards of the semiconductor industry including high-speed sample mapping, a wide thickness measurement range and supports the analysis requirements from process testing to R&D. The UTS-2000 can be configured with near-infrared or mid-infrared according to the thickness measurements required.
System Features
Measurement range
Measure substrate with thickness from 0.25 to 750 µm.
Highly Accurate Film Thickness Measurements
Measurement of precision data using a high-accuracy interferometer and high throughput optics.
Robot Multi-Wafer Cassette
Optional automated cassette sampling system for fully automated measurement of multi-wafer cassettes.
Simple Operating System
Various conditions for measurement, mapping, and film thickness calculations are configured as preset methods and managed in a method table. Measurement of film thickness is initiated by simply selecting a required method from the table and clicking the ‘Measure’ button.